Mounter

ABSTRACT

An electronic component mounter where information indicating completion of component mounting is memorized each time a component is mounted on circuit board by suction nozzle. Then, in a case in which mounting work is interrupted by a stoppage of the electronic component mounter and then restarted, the mounting position of the electronic component is imaged by mark camera according to information memorized immediately before the mounting work was interrupted. Also, with the electronic component mounter, in a case in which mounting work is interrupted by a stoppage of the mounter and then restarted, the mark camera is moved along a path over which the suction nozzle moved until the position of the suction nozzle when mounting work was interrupted. Here, imaging of the circuit board is performed by the mark camera.

TECHNICAL FIELD

The present application relates to a mounter that performs work ofmounting components on a board.

BACKGROUND ART

Mounters pick up and hold an electronic component supplied by acomponent supply device and mount the electronic component on a circuitboard. Work of mounting electronic components is complete when multiplepredetermined electronic components have been mounted on the circuitboard, but there are cases in which mounting work is interrupted due toreasons such as an emergency stop of the mounter. In such a case, asdisclosed in the patent literature below, mounting work is restartedbased on information related to mounting components saved on a storagemedium.

In detail, with the mounter disclosed in the patent literature below,every time an electronic component is mounted on a circuit board by acomponent holding tool, mounting component data that is informationrelated to the mounted component is saved on the storage medium. And, ina case in which mounting work is interrupted by an emergency stop of themounter or the like and then restarted, mounting component informationsaved immediately before the interruption of mounting work is extracted,and the component planned to be mounted next identified from themounting component information is mounted on the circuit board. Thismakes it possible to restart interrupted mounting work.

Patent literature 1: JP-A-2003-31998

SUMMARY Technical Problem

According to the mounter disclosed in the above patent literature, it ispossible to restart interrupted mounting work. However, in a case inwhich mounting work is interrupted due to an emergency stop of themounter occurring within a very short time during mounting of anelectronic component on a circuit board, that is, within a few secondsbefore or after an electronic component is mounted on the circuit board,there are cases in which the timings of mounting the electroniccomponent and saving the mounting component information on the storagemedium are reversed, meaning that the saved mounting componentinformation is different from the actual mounting state of electroniccomponents. In such a case, when mounting work is restarted, there is aworry that mounting work will not be restarted appropriately.

Also, if the mounter stops at timing of mounting an electronic componenton a circuit board, not only may there be a difference between mountingcomponent information saved on the storage medium and the actualmounting state of electronic components, an electronic component may notbe appropriately mounted on the circuit board due to a stoppage of amoving device that moves the component holding tool. In such a casealso, there is a worry that mounting work will not be restartedappropriately.

Further, not only at the timing when an electronic component is mountedon a circuit board, but also when the component holding tool holding theelectronic component is moved above the circuit board by operation of amoving device, if an emergency stop of the mounter occurs, there is aworry that the electronic component will separate from the componentholding tool and the electronic component will drop on the circuitboard. In such a case also, there is a worry that mounting work will notbe restarted appropriately. The present disclosure takes account of suchcircumstances and an object thereof is to appropriately restart mountingwork after a mounting work interruption.

Solution to Problem

To solve the above problems, a mounter of the present disclosure is amounter including: a component holding tool configured to hold acomponent and mount the held component on a board; an imaging deviceconfigured to image any position on a base on which the board is loaded;a control device including a memory section configured to memorizeinformation indicating completion of mounting of the component on theboard for each act of mounting the component on the board by thecomponent holding tool, and a mounting position imaging sectionconfigured to, in a case in which mounting work is interrupted by astoppage of the mounter and then restarted, use the imaging device toimage the mounting position of the component on the board memorized onthe memory section immediately before the mounting work was interrupted.

Also, to solve the above problems, a mounter of the present disclosureis a mounter including: a component holding tool configured to hold acomponent and mount the held component on a board; an imaging deviceconfigured to image any position on a base on which the board is loaded;a control device including a path imaging section configured to, in acase in which mounting work is interrupted by a stoppage of the mounterand then restarted, use the imaging device to image the base on whichthe board is loaded along a path over which the component holding toolmoved until the position of the component holding tool when mountingwork was interrupted; a dropped component determination sectionconfigured to determine whether the component dropped on the base onwhich the board is loaded based on image data captured by the pathimaging section; and a dropped notification section configured to reportinformation to an operator indicating that a component has been droppedin a case in which the component was determined to have been dropped bythe dropped component determination section.

Advantageous Effects

With a mounter of the present disclosure, in a case in which mountingwork is interrupted by a stoppage of the mounter and then restarted, themounting position of the electronic component is imaged by the imagingdevice according to mounting component information memorized immediatelybefore the mounting work was interrupted. By this, it is possible tojudge whether mounting work immediately before the interruption wasperformed appropriately, and it is possible to appropriately restartmounting work. Also, with a mounter of the present disclosure, in a casein which mounting work is interrupted by a stoppage of the mounter andthen restarted, the imaging device is moved along a path over which thecomponent holding tool moved until the position of the holding tool whenmounting work was interrupted. During this time, the imaging deviceimages the base on which the board is loaded. Accordingly, it ispossible to determine whether an electronic component has dropped on thecircuit board or on the base, and it is possible to appropriatelyrestart mounting work.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view of an electronic component mounter.

FIG. 2 is a block diagram showing a control device.

FIG. 3 shows a flowchart of a control program.

FIG. 4 shows a flowchart of a control program.

FIG. 5 shows a flowchart of a control program.

DESCRIPTION OF PREFERRED EMBODIMENTS

The following describes in detail referring to the figures an exampleembodiment of the present disclosure.

Configuration of Electronic Component Mounter.

Electronic component mounter 10 is shown in FIG. 1. Electronic componentmounter 10 is a working machine that mounts electronic components on acircuit board. Electronic component mounter 10 is provided withconveyance device 20, mounting head moving device (hereinafter in somecases abbreviated to “moving device”) 22, mounting head 24, and supplydevice 26.

Conveyance device 20 has a pair of conveyor belts 30 that extend in theX-axis direction, and electromagnetic motor (refer to FIG. 2) 32 thatmoves conveyor belts 30. Circuit board 36 is supported by this pair ofconveyor belts 30 and is conveyed in the X-axis direction by the drivingof electromagnetic motor 32. Also, conveyance device 20 has holdingdevice (refer to FIG. 2) 38. Holding device 38 fixedly holds circuitboard 36 supported by conveyor belts 30 in a predetermined position (theposition at which circuit board 36 is shown in FIG. 1).

Moving device 22 is configured from X-axis direction sliding mechanism50 and Y-axis direction sliding mechanism 52. X-axis direction slidemechanism 50 has X-axis slider 56 provided on base 54 so as to bemovable in the X-axis direction. X-axis slider 56 is moved to anyposition in the X-axis direction by the driving of electromagnetic motor(refer to FIG. 2) 58. In addition, Y-axis direction slide mechanism 52has Y-axis slider 60 provided on a side surface of X-axis slider 56 soas to be movable in the Y-axis direction. Y-axis slider 60 is moved toany position in the Y-axis direction by the driving of electromagneticmotor (refer to FIG. 2) 62. Mounting head 24 is attached to Y-axisslider 60. According to such a structure, mounting head 24 is moved toany position on base 54 by moving device 22.

Mounting head 24 mounts electronic components on circuit board 36.Mounting head 24 includes suction nozzle 70 that is provided on a lowerend surface of the mounting head. Suction nozzle 70 is connected topositive/negative pressure supply device (refer to FIG. 2) 72 via anegative pressure air/positive pressure air supply passage. Suctionnozzle 70 picks up and holds an electronic component using negativepressure, and releases the held electronic component using positivepressure.

Supply device 26 is a feeder type supply device that has multiple tapefeeders 76. Tape feeders 76 house taped components in a wound state.Taped components are electronic components that have been put into tape.Tape feeders 76 deliver the taped components using indexing device(refer to FIG. 2) 78. By this, feeder type supply device 26 supplies anelectronic component to a supply position by the indexing of tapedcomponents.

Also, electronic component mounter 10 is provided with mark camera 80and display device (refer to FIG. 2) 82. Mark camera 80 is providedfacing down on a lower end surface of Y-axis slider 60 of moving device22. By this, mark camera 80 is able to image any position on base 54.Display device 82 is provided at a position visible to an operator, andinformation related to work is displayed on display device 82.

Further, as shown in FIG. 2, electronic component mounter 10 is providedwith control device 100. Control device 100 is provided with datastorage region 101, controller 102, multiple drive circuits 104, andcontrol circuit 106. The multiple drive circuits 104 are connected tothe above electromagnetic motors 32, 58, and 62, holding device 38,positive/negative pressure supply device 72, and indexing device 78.Controller 102 is provided with a CPU, ROM, RAM, and so on, is formedmainly from a computer, and is connected to the multiple drive circuits104. By this, operation of conveyance device 20, moving device 22, andso on is controlled by controller 102.

Controller 102 is also connected to control circuit 106, and controlcircuit 106 is connected to display device 82. By this, a given image isdisplayed on display device 82. Also, data storage region 101 is formemorizing various information and is connected to controller 102. Bythis, controller 102 acquires various information memorized in datastorage region 101. Further, controller 102 is also connected to imageprocessing device 107. Image processing device 107 is for processingimage data acquired by mark camera 80, and controller 102 acquiresvarious information from the image data.

Mounting Work by the Electronic Component Mounter

With electronic component mounter 10, mounting work of mountingelectronic components on circuit board 36 is performed using the aboveconfiguration. Specifically, circuit board 36 is conveyed to a workposition by conveyance device 20, and is fixedly held at that positionby holding device 38. Also, tape feeders 76 feed taped components andsupply electronic components to supply positions. Then, mounting head 24moves above the supply position of the electronic component and picks upand holds the electronic component using suction nozzle 70. Continuing,mounting head 24 moves above the circuit board and mounts the heldelectronic component on the circuit board. Then, when mounting work iscomplete for the circuit board 36, by operation of conveyance device 20,the circuit board 36 for which mounting work is complete is unloadedfrom electronic component mounter 10.

Checking the Mounting Position and Path when Mounting Work Restarts

With electronic component mounter 10, as given above, an electroniccomponent supplied by tape feeder 76 is picked up and held by suctionnozzle 70 and then mounted on the circuit board. Work of mountingelectronic components on circuit board 36 is complete when multiplepredetermined electronic components have been mounted on circuit board36, but there are cases in which mounting work is interrupted due toreasons such as an emergency stop of electronic component mounter 10. Insuch a case, mounting work is restarted based on information related tomounting component memorized on data storage region 101.

In detail, with electronic component mounter 10, every time anelectronic component is mounted on circuit board 36 by suction nozzle70, mounting component data that is information related to the mountedcomponent is saved in data storage region 101. Note that, mountingcomponent information includes information such as the type of mountedelectronic component, and the position of the mounted electroniccomponent. And, in a case in which mounting work is interrupted by anemergency stop of electronic component mounter 10 or the like and thenrestarted, mounting component information memorized immediately beforethe interruption of mounting work is extracted, and the componentplanned to be mounted next identified from the mounting componentinformation is mounted on circuit board 36. However, in a case in whichmounting work is interrupted due to an emergency stop of electroniccomponent mounter 10 occurring within a very short time during mountingof an electronic component on circuit board 36, that is, within a fewseconds before or after an electronic component is mounted on circuitboard 36, there are cases in which the timings of mounting theelectronic component and memorizing the mounting component informationin data storage region 101 are reversed, meaning that the mountingcomponent information memorized in data storage region 101 is differentfrom the actual mounting state of electronic components. In such a case,when mounting work is restarted, there is a worry that mounting workwill not be restarted appropriately.

Specifically, for example, there are cases in which mounting componentinformation of an electronic component is memorized in data storageregion 101 on the assumption that mounting work of mounting theelectronic component to circuit board 36 is completed when a specifiedamount of positive pressure is supplied to suction nozzle 70. In such acase, if mounting work is interrupted immediately after the specifiedamount of positive pressure is supplied to suction nozzle 70, themounting component information of that electronic component is memorizedin data storage section 101. However, there may be cases in which due tothe stoppage of positive/negative pressure supply device 72, the supplyof positive pressure to suction nozzle 70 becomes insufficient, and theelectronic component fails to separate from suction nozzle 70 and is notmounted on circuit board 36. That is, although mounting componentinformation is memorized in data storage region 101, the electroniccomponent corresponding to that mounting component information may notbe mounted on circuit board 36. In such a case, if mounting work isrestarted according to the above procedure, because mounting componentinformation of the electronic component is memorized in data storageregion 101 even though that electronic component was not mounted, adefective board will be produced with the electronic component notmounted on circuit board 36.

Also, if mounting work is interrupted immediately before the specifiedamount of positive pressure is supplied to suction nozzle 70, themounting component information of that electronic component is notmemorized in data storage section 101. However, the electronic componentmay separate from suction nozzle 70 and be mounted on circuit board 36before the specified amount of positive pressure is supplied to suctionnozzle 70. That is, although mounting component information is notmemorized in data storage region 101, the electronic componentcorresponding to that mounting component information may be mounted oncircuit board 36. In such a case, if mounting work is restartedaccording to the above procedure, an electronic component may be mountedon top of the already mounted electronic component. That is, doublemounting of electronic components may occur.

Also, if electronic component mounter 10 is stopped as the electroniccomponent is mounted on circuit board 36, not only may there be adifference between mounting component information memorized in datastorage region 101 and the actual mounting state of electroniccomponents, an electronic component may not be appropriately mounted oncircuit board 36 due to the stoppage of positive/negative pressuresupply device 72, moving device 22, and so on.

Further, not only at the timing when an electronic component is mountedon circuit board 36, but also when suction nozzle 70 holding theelectronic component is moved above circuit board 36 or base 54 byoperation of moving device 22, if an emergency stop of electroniccomponent mounter 10 occurs, there is a worry that the electroniccomponent will separate from suction nozzle 70 and will drop on circuitboard 36 or base 54. Here, if the electronic component that dropped isleft on circuit board 36, this will result in a defective board.

Thus, with electronic component mounter 10, in a case in which mountingwork is interrupted by an emergency stop of electronic component mounter10 or the like and then restarted, checking of the mounting position ofthe electronic component mounted immediately before mounting work wasinterrupted is performed, and checking of the movement path of suctionnozzle 70 is performed.

In detail, in a case in which mounting work is interrupted by anemergency stop of electronic component mounter 10 or the like and thenrestarted, mounting component information memorized immediately beforethe interruption of mounting work is extracted, and the mountingposition of the electronic component according to that mountingcomponent information is identified. When the mounting position of theelectronic component is identified, mark camera 80 is moved by operationof moving device 22 above the identified mounting position, and thatmounting position is imaged by mark camera 80. Then, image data obtainedfrom that image is analyzed at controller 102, and it is determinedwhether the electronic component is appropriately mounted at theidentified mounting position. Note, with this determination, whether theelectronic component is mounted at the mounting position is determined,and in a case in which the electronic component is mounted at themounting position, whether the electronic component is appropriatelymounted at the planned mounting position is determined. That is, incases such as when the electronic component is not mounted at themounting position, or the electronic component is mounted at the plannedmounting position in a deviated state, it is determined that theelectronic component is not appropriately mounted at the mountingposition. Then, when it is determined that the electronic component isnot appropriately mounted at the identified mounting position, a screenindicating that fact (referred to below as “mounting error warningscreen”) is displayed on display device 82. By this, an operator is madeaware that mounting work has not been performed appropriately at theidentified mounting position, and can perform countermeasures toinappropriate mounting work. That is, an operator can performcountermeasures to prevent the occurrence of a missing electroniccomponent due to mounting component information being memorized in datastorage region 101 but the electronic component according to thatmounting component information not having been mounted on circuit board36, and countermeasures to inappropriate mounting of an electroniccomponent that occurs due to an emergency stop of electronic componentmounter 10.

Also, with electronic component mounter 10, in a case in which mountingwork is interrupted by an emergency stop of electronic component mounter10 or the like and then restarted, controller 102 determines whethersuction nozzle 70 is holding the electronic component planned to be heldafter mounting work is restarted. Note that, the presence or absence ofan electronic component being held on suction nozzle 70 is determinedbased on the amount of negative pressure supplied by positive/negativesupply device 72.

And, in a case in which the electronic component planned to be held isnot being held by suction nozzle 70, mark camera 80 is moved along themovement path of suction nozzle 70 and imaging is performed by markcamera 80. In detail, during mounting work, the movement path ofmounting head 24 by moving device 22 is memorized in data storage region101. Then, in a case in which mounting work is interrupted by anemergency stop of electronic component mounter 10 or the like and thenrestarted, the movement path of mounting head 24 until the positionwhere mounting work was interrupted is extracted from data storageregion 101. Note that, the starting point of the extracted movement pathis the supply position of the electronic component at tape feeder 76.That is, the movement path of mounting head 24 from the supply positionof the electronic component at tape feeder 76 to the position ofmounting head 24 when mounting work was interrupted is extracted fromthe movement path of mounting head 24.

When the movement path of mounting head 24 is extracted, mounting head24 is moved by operation of moving device 22 along the extractedmovement path of mounting head 24. Here, circuit board 26 and base 54are imaged by mark camera 80. Then, image data obtained from thatimaging is analyzed at controller 102, and it is determined whether theelectronic component dropped on circuit board 36 or base 54. Note that,with this determination, it is determined whether an electroniccomponent is present at a position other than according to the mountingcomponent information memorized in data storage region 101, and in acase in which an electronic component is present at a position otherthan according to the mounting component information memorized in datastorage region 101, it is determined that an electronic component hasdropped on circuit board 36 or base 54. And, in a case in which it isdetermined that an electronic component has not dropped on circuit board36 or base 54, a screen indicating that fact (referred to below as “nodropped component warning screen”) is displayed on display device 82.

On the other hand, in a case in which it is determined that anelectronic component has dropped on circuit board 36 or base 54, it isdetermined whether that dropped electronic component is the electroniccomponent mounted at the correct mounting position. Note, with thisdetermination, it is determined whether the mounting position of theelectronic component planned to be mounted next according to themounting component information memorized immediately before mountingwork was interrupted and the position of the electronic componentdetermined to have been dropped match, and if it is determined that theymatch, the dropped electronic component is determined to be theelectronic component mounted at the correct mounting position. That is,as given above, in a case in which an electronic component according tothe mounting component information is mounted on circuit board 36 eventhough the component mounting information is not memorized in controldevice 100, that component is determined to be a dropped component, andthat dropped component is determined to be the electronic componentmounted at the correct mounting position. Then, in a case in which thatdropped electronic component is determined to be the electroniccomponent mounted at the correct mounting position, it is determinedthat mounting work of that component is complete, and mounting componentinformation according to that component is memorized in control device100. By this, even if mounting component information is not memorized incontrol device 100, because the electronic component according to thatmounting component information is mounted on circuit board 36, it ispossible to prevent double-mounting of the electronic component.

Also, in a case in which it is determined that the dropped electroniccomponent is not the electronic component mounted at the correctmounting position, a screen indicating that the electronic component hasbeen dropped on circuit board 36 or base 54 (referred to as “droppedcomponent present warning screen”) is displayed on display device 82.Note that, information indicating the position of the dropped componentis also displayed on the dropped component present warning screen. Notethat, information indicating the position of the dropped component iscalculated based on image data from mark camera 80 and informationrelated to the movement position of mounting head 24 moved by movingdevice 22. By this, an operator can easily perform collection of thedropped electronic component.

Control Program

The above mounting work of electronic components and work of checkingthe mounting position and path at restart of mounting work is performedby a control program being run on control device 100. The flow when thiscontrol program is run is described below with reference to FIGS. 3 to5.

With the control program, first, the Nth electronic component that isthe target for mounting work is made to be zero (S100). Next, it isdetermined whether there is an electronic component already mounted oncircuit board 36 (S102). That is, it is determined whether mountingcomponent information is memorized in data storage region 101. Here, ifmounting component information is not memorized in data storage region101 (S102 is no), one is added to N (S104). Next, mounting work of theNth electronic component is performed (S106).

Then, when mounting work of the Nth electronic component is performed,mounting component information according to that Nth electroniccomponent is memorized in data storage region 101 (S108). Continuing, itis determined whether mounting work is complete for all the electroniccomponents to be mounted on circuit board 36 (S110). Then, in a case inwhich mounting work is not complete for all the electronic components(S110 is no), processing returns to S104. On the other hand, in a casein which mounting work is complete for all the electronic components(S110 is yes), the control program ends. In this manner, if mountingwork is not interrupted, by performing processing of S100 to S110,mounting work on circuit board 36 is performed.

On the other hand, in a case in which mounting work is interrupted andthen restarted, the control program is run, but when mounting work isrestarted, because mounting component information is memorized in datastorage region 101 before mounting work is interrupted, in S102 it isdetermined that there is an already mounted electronic component oncircuit board 36. Then, in a case when it is determined that there is analready mounted electronic component on circuit board 36 (S102 is yes),the Nth electronic component that is a target for mounting work is takenas X (S112). Here, X is the number of the electronic component accordingto the mounting component information memorized in data storage region101 immediately before mounting work was interrupted.

Next, when the Nth electronic component that is a target for mountingwork is taken as X, mark camera 80 is moved above the mounting positionof that Xth electronic component, and the mounting position is imaged bymark camera 80 (S114). Then, based on the image data obtained by theimaging, it is determined whether the electronic component isappropriately mounted at the mounting position (S116). In a case inwhich it is determined that the electronic component is notappropriately mounted at the mounting position (S116 is no), a mountingerror warning screen is displayed on display device 82 (S118). Then,processing proceeds to S120. On the other hand, in a case in which it isdetermined that the electronic component is appropriately mounted at themounting position (S116 is yes), processing of S118 is skipped, andprocessing proceeds to S120.

In S120, it is determined whether the electronic component dropped fromsuction nozzle 70. That is, it is determined whether suction nozzle 70is holding the electronic component that is planned to be held. Then, ina case in which it is determined that the electronic component plannedto be held is not being held by suction nozzle 70, that is, it isdetermined that the electronic component has dropped from suction nozzle70 (S120 is yes), the movement path of mounting head 24 until theposition of mounting head 24 when mounting work was interrupted isextracted from data storage region 101, and mark camera 80 performsimaging along that movement path (S122).

Then, based on the image data obtained by the imaging, it is determinedwhether the electronic component was dropped on the movement path(S124). In a case in which it is determined that the electroniccomponent has dropped on the movement path (S124 is yes), it isdetermined whether that dropped electronic component is the electroniccomponent mounted at the correct mounting position (S126). In a case inwhich it is determined that the dropped electronic component is not theelectronic component mounted at the correct mounting position (S126 isno), the dropped component present warning screen is displayed ondisplay device 82 (S128). Then, processing proceeds to S130.

On the other hand, in a case in which it is determined that the droppedelectronic component is the electronic component mounted at the correctposition (S126 is yes), mounting component information according to thatelectronic component is memorized in data storage region 101, and as itis necessary to indicate that mounting work of that electronic componentis complete, one is added to the Nth electronic component that is thetarget for mounting work (S132). Then, processing proceeds to S130.

Next, in S130, the interrupted mounting work should be restarted, so oneis added to the Nth electronic component that is the target for mountingwork. Then, processing returns to S106. Also, in a case in which it isdetermined in S124 that the electronic component has not dropped on themovement path (S124 is no), the no dropped component warning screen isdisplayed on display device 82 (S134). Then, processing from S130 isperformed. Also, in a case in which it is determined in S120 that theelectronic component has not dropped from suction nozzle 70 (S120 isno), processing from S130 is performed.

Note that, controller 102 of control device 100 should perform work ofchecking the mounting position and path when mounting work is restarted,thus, as shown in FIG. 2, controller 102 includes memory section 108,mounting position imaging section 110, mounting determination section112, error notification section 114, path imaging section 116, droppedcomponent determination section 118, dropped notification section 120,and holding determination section 122. Memory section 108 is afunctional section for performing processing of S108 and S132 of theabove control program, that is, processing of memorizing mountingcomponent information of an electronic component for which mounting workis complete in data storage region 101. Mounting position imagingsection 110 is a functional section for performing processing of S114 ofthe above control program, that is, processing of imaging the mountingposition using mark camera 80. Mounting determination section 112 is afunctional section for performing processing of S116 of the abovecontrol program, that is, processing of determining whether anelectronic component is appropriately mounted at the mounting position.Error notification section 114 is a functional section for performingprocessing of S118 of the above control program, that is, for performingprocessing of notifying an operator that the electronic component is notappropriately mounted at the mounting position. Path imaging section 116is a functional section for performing processing of S122 of the abovecontrol program, that is, for performing processing of imaging themovement path of mounting head 24 using mark camera 80. Droppedcomponent determination section 118 is a functional section forperforming processing of S124 of the above control program, that is, forperforming processing of determining whether an electronic componentdropped on the movement path of mounting head 24. Dropped notificationsection 120 is a functional section for performing processing of S128 ofthe above control program, that is, for performing processing ofnotifying that an electronic component dropped on the movement path ofmounting head 24. Holding determination section 122 is a functionalsection for performing processing of S120 of the above control program,that is, processing of determining whether an electronic componentplanned to be held is being held on suction nozzle 70.

Note that, in the above embodiments, electronic component mounter 10 isan example of a mounter. Baser 54 is an example of a base. Suctionnozzle 70 is an example of a component holding tool. Mark camera 80 isan example of an imaging device. Control device 100 is an example of acontrol device. Memory section 108 is an example of a memory section.Mounting position imaging section 110 is an example of a mountingposition imaging section. Mounting determination section 112 is anexample of a mounting determination section. Error notification section114 is an example of an error notification section. Path imaging section116 is an example of a path imaging section. Dropped componentdetermination section is an example of a dropped component determinationsection. Dropped notification section 120 is an example of a droppednotification section. Holding determination section 122 is an example ofa holding determination section.

Further, the present disclosure is not limited to the above exampleembodiments, and various changed or improved methods of embodiment arepossible based on the knowledge of someone skilled in the art.Specifically, for example, in the above embodiments, the mounting errorwarning screen and the like are displayed on display device 82, but thecontents of the screen may be notified to an operator using sound or thelike.

Also, in the above embodiments, controller 102 determines whether anelectronic component is appropriately mounted at the mounting positionbased on image data of the mounting position, but an operator may makethis determination. That is, an image based on the image data of themounting position may be displayed on display device 82, and an operatormay determine whether an electronic component is appropriately mountedat the mounting position based on image data. Then, the operator mayenter the determination result into control device 100, and controller102 may perform processing according to the entered result.

Also, in the above embodiments, the movement path of mounting head 24imaged using mark camera 80 is taken as the path from the supplyposition of the electronic component from tape feeder 76 to the positionof mounting head 24 when mounting work was interrupted, but mark camera80 may image only above circuit board 36 as the movement path ofmounting head 24.

REFERENCE SIGNS LIST

10: electronic component mounter (mounter); 54: base; 70: suction nozzle(component holding tool); 80: mark camera (imaging device); 100: controldevice; 108: memory section; 110: mounting position imaging section;112: mounting determination section; 114: error notification section;116: path imaging section; 118: component determination section; 120:dropped notification section; 122: holding determination section

1. A mounter comprising: a component holding tool configured to hold acomponent and mount the held component on a board; an imaging deviceconfigured to image any position on a base on which the board is loaded;a control device including a memory section configured to memorizeinformation indicating completion of mounting of the component on theboard for each act of mounting the component on the board by thecomponent holding tool, and a mounting position imaging sectionconfigured to, in a case in which mounting work is interrupted by astoppage of the mounter and then restarted, use the imaging device toimage the mounting position of the component on the board memorized onthe memory section immediately before the mounting work was interrupted.2. The mounter according to claim 1, wherein the control device furtherincludes a mounting determination section configured to determinewhether the component was mounted at the mounting position correctlybased on image data captured by the mounting position imaging section,and an error reporting section configured to report information to anoperator indicating that mounting of the component at the mountingposition was not correct in a case in which the mounting determinationsection determines that mounting of the component at the mountingposition was not correct.
 3. The mounter according to claim 1, whereinthe control section further includes a path imaging section configuredto, in a case in which mounting work is interrupted by a stoppage of themounter and then restarted, use the imaging device to image the base onwhich the board is loaded along a path over which the component holdingtool moved until the position of the component holding tool whenmounting work was interrupted; a dropped component determination sectionconfigured to determine whether the component dropped on the base onwhich the board is loaded based on image data captured by the pathimaging section; and a dropped notification section configured to reportinformation to an operator indicating that a component has been droppedin a case in which the component was determined to have been dropped bythe dropped component determination section.
 4. A mounter comprising: acomponent holding tool configured to hold a component and mount the heldcomponent on a board; an imaging device configured to image any positionon a base on which the board is loaded; a control device including apath imaging section configured to, in a case in which mounting work isinterrupted by a stoppage of the mounter and then restarted, use theimaging device to image the base on which the board is loaded along apath over which the component holding tool moved until the position ofthe component holding tool when mounting work was interrupted; a droppedcomponent determination section configured to determine whether thecomponent dropped on the base on which the board is loaded based onimage data captured by the path imaging section; and a droppednotification section configured to report information to an operatorindicating that a component has been dropped in a case in which thecomponent was determined to have been dropped by the dropped componentdetermination section.
 5. The mounter according to claim 4, wherein thecontrol device further includes a holding determination sectionconfigured to, in a case in which mounting work is interrupted by astoppage of the mounter and then restarted, determine whether thecomponent holding tool is holding the component planned to be held aftermounting work is restarted, and the path imaging section is configuredto, when the holding determination section determines that the componentholding tool is not holding the component, use the imaging device toimage the base on which the board is loaded along a path over which thecomponent holding tool moved until the position of the component holdingtool when mounting work was interrupted.
 6. The mounter according toclaim 4, wherein the control device further includes a memory sectionconfigured to memorize information indicating completion of mounting ofthe component on the board for each act of mounting the component on theboard by the component holding tool; a mounting position imaging sectionconfigured to, in a case in which mounting work is interrupted by astoppage of the mounter and then restarted, use the imaging device toimage the mounting position of the component on the board memorized onthe memory section immediately before the mounting work was interrupted;a mounting determination section configured to determine whether thecomponent was mounted at the mounting position correctly based on imagedata captured by the mounting position imaging section, and an errorreporting section configured to report information to an operatorindicating that mounting of the component at the mounting position wasnot correct in a case in which the mounting determination sectiondetermines that mounting of the component at the mounting position wasnot correct.